A Poly-Resistor Based Temperature Sensing Chip with Digital Output
Lokesh L1, Shashidhar Tantry2, Karthik M3
1Prof. Lokesh L, Department of Electronics and Communications, PES University, Bangalore (Karnataka), India.
2Dr. Shashidhar Tantry, Department of Electronics and Communications, PES University, Bangalore (Karnataka), India.
3Karthik M, Department of Electronics and Communications, PES University, Bangalore (Karnataka), India.
Manuscript received on 14 May 2025 | First Revised Manuscript received on 15 June 2025 | Second Revised Manuscript received on 18 August 2025 | Manuscript Accepted on 15 September 2025 | Manuscript published on 30 September 2025 | PP: 1-5 | Volume-5 Issue-2, September 2025 | Retrieval Number: 100.1/ijvlsid.B123205020925 | DOI: 10.54105/ijvlsid.B1232.05020925
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© The Authors. Published by Lattice Science Publication (LSP). This is an open access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: This work presents a resistor-based temperature sensing chip which is designed for applications that require temperature sensing. The core of the design is a poly-resistor bridge, which generates two distinct outputs: one varies with temperature and the other provides a constant reference. These outputs are then processed by a differential amplifier, ensuring reliable signal amplification and enhanced separation of the temperature-dependent signal from the reference. The amplified signal is then digitized using a compact 3-bit ADC, that is realized using an 8:3 encoder. The simplified integration of the resistor bridge, differential amplifier, and ADC demonstrates a practical approach for temperature sensing, offering a versatile solution for systems where basic thermal monitoring is essential.
Keywords: Poly-Resistors, ADC (Analogue to Digital Converter), Resistor-Bridge, FDDA (Fully Differential Difference Amplifier).
Scope of the Article: Emerging Trends in VLSI Design and Technology